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K4F6E3S4HM-MGCJ

Manufacturer

Samsung Electro-mechanics
Manufacturer's Part Number

K4F6E3S4HM-MGCJ
Description

LPDDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 200; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Datasheet

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K4F6E3S4HM-MGCJ Technical Details

TYPE	DESCRIPTION
Other Names:	3277-K4F6E3S4HM-MGCJ
Package Body Material:	PLASTIC/EPOXY
Memory Density:	17179869184 bit
Organization:	512MX32
Surface Mount:	YES
Memory IC Type:	LPDDR4 DRAM
Minimum Operating Temperature:	-25 Cel
Memory Width:	32
No. of Functions:	1
No. of Terminals:	200
No. of Words:	536870912 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
No. of Words Code:	512M
JESD-30 Code:	R-PBGA-B200
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Nominal Supply Voltage / Vsup (V):	1.1
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Temperature Grade:	OTHER

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