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K4A8G085WB-BCPB

Manufacturer

Samsung
Manufacturer's Part Number

K4A8G085WB-BCPB
Description

DDR4 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet

Datasheet

Not In Stock

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K4A8G085WB-BCPB Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.016 Amp
Output Characteristics:	3-STATE
Sub-Category:	DRAMs
Surface Mount:	YES
Maximum Supply Current:	170 mA
No. of Terminals:	78
Maximum Clock Frequency (fCLK):	1066 MHz
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B78
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Input/Output Type:	COMMON
Memory Density:	8589934592 bit
Sequential Burst Length:	4,8
Memory IC Type:	DDR4 DRAM
Minimum Operating Temperature:	0 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA78,9X13,32
Refresh Cycles:	8192
Interleaved Burst Length:	4,8
Maximum Access Time:	.18 ns
Nominal Supply Voltage / Vsup (V):	1.2
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Power Supplies (V):	1.2

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