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W3H32M64E-533SBI

Manufacturer

Microsemi
Manufacturer's Part Number

W3H32M64E-533SBI
Description

DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;
Datasheet

Datasheet

Not In Stock

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W3H32M64E-533SBI Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32MX64
Maximum Time At Peak Reflow Temperature (s):	30
Access Mode:	FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Terminals:	208
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B208
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
No. of Ports:	1
Memory Density:	2147483648 bit
Self Refresh:	YES
Memory IC Type:	DDR2 DRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	64
No. of Functions:	1
Qualification:	Not Qualified
Maximum Access Time:	.65 ns
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	AUTO/SELF REFRESH
Peak Reflow Temperature (C):	225
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.9 V

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