W3H32M64E-533SBI by Mercury Systems

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

W3H32M64E-533SBI

  • Manufacturer
    Mercury Systems
  • Manufacturer's Part Number
    W3H32M64E-533SBI
  • Description
    DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B208;
  • Datasheet

Not In Stock

Please provide a valid Quantity between 1 and 1000,000,000.
Please provide a valid Email Address.

Popular Products

W3H32M64E-533SBI Technical Details

TYPE DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32MX64
Maximum Time At Peak Reflow Temperature (s): 30
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Terminals: 208
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B208
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: BGA
No. of Ports: 1
Memory Density: 2147483648 bit
Self Refresh: YES
Memory IC Type: DDR2 DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 64
No. of Functions: 1
Qualification: Not Qualified
Maximum Access Time: .65 ns
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): 225
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.9 V

Category Top Products