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W631GU6NB09I

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W631GU6NB09I
Description

DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 1073741824 bit;
Datasheet

Datasheet

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W631GU6NB09I Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.06 Amp
Organization:	64MX16
Output Characteristics:	3-STATE
Maximum Seated Height:	1 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.283 V
Surface Mount:	YES
Maximum Supply Current:	270 mA
No. of Terminals:	96
Maximum Clock Frequency (fCLK):	1066 MHz
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B96
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	95 Cel
Package Code:	VFBGA
Width:	7.5 mm
Other Names:	256-W631GU6NB09I
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	1073741824 bit
Self Refresh:	YES
Sequential Burst Length:	8
Memory IC Type:	DDR3L DRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Package Equivalence Code:	BGA96,9X16,32
Interleaved Burst Length:	8
Length:	13 mm
Maximum Access Time:	20 ns
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	1.35
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.45 V

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