MT53E1G32D2FW-046IT:B by Micron Technology

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MT53E1G32D2FW-046IT:B

Manufacturer

Micron Technology
Manufacturer's Part Number

MT53E1G32D2FW-046IT:B
Description

LPDDR4 DRAM; No. of Terminals: 200; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Access Mode: MULTI BANK PAGE BURST;
Datasheet

Datasheet

2452 In Stock

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MT53E1G32D2FW-046IT:B Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	1GX32
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.1 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.06 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	200
Maximum Clock Frequency (fCLK):	2136.7 MHz
No. of Words:	1073741824 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B200
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	95 Cel
Package Code:	TFBGA
Width:	10 mm
Other Names:	557-MT53E1G32D2FW-046IT:B
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	34359738368 bit
Self Refresh:	YES
Sequential Burst Length:	16,32
Memory IC Type:	LPDDR4 DRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	32
No. of Functions:	1
Package Equivalence Code:	BGA200,12X20,32/25
Interleaved Burst Length:	16,32
Length:	14.5 mm
No. of Words Code:	1G
Nominal Supply Voltage / Vsup (V):	1.1
Additional Features:	TERMINAL_PITCH_MAX; SELF REFRESH; ALSO OPERATES WITH 1.8V NOMINAL SUPPLY
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Maximum Supply Voltage (Vsup):	1.17 V

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