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W989D6DBGX6E

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W989D6DBGX6E
Description

SYNCHRONOUS DRAM; No. of Terminals: 54; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.025 mm; Technology: CMOS;
Datasheet

Datasheet

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W989D6DBGX6E Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	32MX16
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.025 mm
Access Mode:	FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Terminals:	54
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B54
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	TFBGA
Width:	8 mm
Other Names:	256-W989D6DBGX6E
No. of Ports:	1
Memory Density:	536870912 bit
Self Refresh:	YES
Memory IC Type:	SYNCHRONOUS DRAM
Memory Width:	16
No. of Functions:	1
Length:	9 mm
Maximum Access Time:	5 ns
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	AUTO/SELF REFRESH
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	.8 mm
Maximum Supply Voltage (Vsup):	1.95 V

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