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BQ51003YFPR

Manufacturer

Texas Instruments
Manufacturer's Part Number

BQ51003YFPR
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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BQ51003YFPR Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Battery Supply (V):	5
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	.5 mm
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	28
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code:	R-XBGA-B28
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Width:	1.88 mm
Moisture Sensitivity Level (MSL):	1
Other Names:	296-39952-2 -296-39952-1-ND 296-39952-1 296-39952-6 BQ51003YFPR-ND
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Length:	3 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.4 mm
Temperature Grade:	INDUSTRIAL

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