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SA612AD/01,118

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SA612AD/01,118
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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SA612AD/01,118 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.75 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD SILVER
No. of Terminals:	8
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
JESD-30 Code:	R-PDSO-G8
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	LSSOP
Width:	3.9 mm
Moisture Sensitivity Level (MSL):	1
Other Names:	568-5045-6 935275263118 SA612AD/01,118-ND 954-SA612AD/01118 568-5045-2 SA612AD/01-T 568-5045-1 SA612AD/01-T-ND SA612AD01118 SA612AD/01118-CHP
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Length:	4.9 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL

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