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SJA1105TELY

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SJA1105TELY
Description

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 159; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.5 mm;
Datasheet

Datasheet

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SJA1105TELY Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.2 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	1.5 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	159
Package Equivalence Code:	BGA159,14X14,32
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Data Rate:	100 Mbps
Screening Level:	AEC-Q100
Length:	12 mm
JESD-30 Code:	S-PBGA-B159
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Peak Reflow Temperature (C):	260
Package Code:	LFBGA
Width:	12 mm
Terminal Pitch:	.8 mm
Moisture Sensitivity Level (MSL):	3

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