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VSC8501XML-03

Manufacturer

Microsemi
Manufacturer's Part Number

VSC8501XML-03
Description

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 135; Package Code: QCCN; Package Shape: SQUARE;
Datasheet

Datasheet

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VSC8501XML-03 Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Telecom IC Type:	TELECOM CIRCUIT
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	135
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER
JESD-30 Code:	S-XQCC-N135
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	125 Cel
Peak Reflow Temperature (C):	NOT SPECIFIED
Package Code:	QCCN
Temperature Grade:	AUTOMOTIVE

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