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MAX2771ETI+
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ManufacturerAnalog Devices
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Manufacturer's Part NumberMAX2771ETI+
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
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Datasheet
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DetailsMAX2771ETI+ Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 2.85 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .8 mm |
Surface Mount: | YES |
Terminal Finish: | Matte Tin (Sn) - annealed |
No. of Terminals: | 28 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | BICMOS |
JESD-30 Code: | S-XQCC-N28 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVQCCN |
Width: | 5 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Package Equivalence Code: | LCC28,.2SQ,20 |
Length: | 5 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |