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SA606DK/01
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSA606DK/01
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
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Datasheet
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DetailsSA606DK/01 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 20 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| Length: | 6.5 mm |
| JESD-30 Code: | R-PDSO-G20 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LSSOP |
| Width: | 4.4 mm |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
