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SA606DK/01,112
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSA606DK/01,112
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
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Datasheet
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DetailsSA606DK/01,112 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.5 mm |
Surface Mount: | YES |
Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
No. of Terminals: | 20 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
JESD-30 Code: | R-PDSO-G20 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LSSOP |
Width: | 4.4 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 6.5 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | INDUSTRIAL |