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WL1831MODGBMOCR
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ManufacturerTexas Instruments
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Manufacturer's Part NumberWL1831MODGBMOCR
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DescriptionTELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 100; Package Code: LGA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsWL1831MODGBMOCR Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.7 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 2 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 100 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Data Rate: | 100 Mbps |
JESD-30 Code: | R-PBGA-B100 |
Package Shape: | RECTANGULAR |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 70 Cel |
Package Code: | LGA |
Width: | 13.3 mm |
Moisture Sensitivity Level (MSL): | 3 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -20 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | LGA100(UNSPEC) |
Length: | 13.4 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .7 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 2.9/4.8 |