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MGC3030-I/SS

Manufacturer

Microchip Technology
Manufacturer's Part Number

MGC3030-I/SS
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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MGC3030-I/SS Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	40
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	2 mm
Surface Mount:	YES
Terminal Finish:	MATTE TIN
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	28
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, SHRINK PITCH
Length:	10.2 mm
JESD-30 Code:	R-PDSO-G28
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	SSOP
Width:	5.3 mm
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	2

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