BGT24MR2E6327XUMA1 by Infineon Technologies

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BGT24MR2E6327XUMA1

Manufacturer

Infineon Technologies
Manufacturer's Part Number

BGT24MR2E6327XUMA1
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
Datasheet

Datasheet

Not In Stock

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BGT24MR2E6327XUMA1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.9 mm
Surface Mount:	YES
Terminal Finish:	TIN
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	32
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length:	5.5 mm
Technology:	BIPOLAR
JESD-30 Code:	R-PQCC-N32
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	105 Cel
Package Code:	HVQCCN
Width:	4.5 mm
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	3

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