BGT24MR2E6327XUMA1 by Infineon Technologies

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BGT24MR2E6327XUMA1

  • Manufacturer
    Infineon Technologies
  • Manufacturer's Part Number
    BGT24MR2E6327XUMA1
  • Description
    TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;
  • Datasheet

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BGT24MR2E6327XUMA1 Technical Details

TYPE DESCRIPTION
Other Names: BGT24MR2E6327XUMA1TR
BGT24MR2E6327XUMA1CT
BGT24MR2E6327XUMA1DKR
BGT 24MR2 E6327
2156-BGT24MR2E6327XUMA1TR
SP001140088
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .9 mm
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 32
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 5.5 mm
Technology: BIPOLAR
JESD-30 Code: R-PQCC-N32
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 105 Cel
Package Code: HVQCCN
Width: 4.5 mm
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 3

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