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ZGM130S037HGN2R
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ManufacturerSilicon Labs
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Manufacturer's Part NumberZGM130S037HGN2R
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: QCCN; Package Shape: SQUARE;
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Datasheet
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DetailsZGM130S037HGN2R Technical Details
TYPE | DESCRIPTION |
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Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 1.3 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 64 |
Package Equivalence Code: | LCC64,.35SQ,20 |
Terminal Position: | QUAD |
Package Style (Meter): | CHIP CARRIER |
Length: | 9 mm |
JESD-30 Code: | S-PQCC-N64 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | QCCN |
Width: | 9 mm |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Moisture Sensitivity Level (MSL): | 3 |