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ZGM130S037HGN2R
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ManufacturerSilicon Labs
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Manufacturer's Part NumberZGM130S037HGN2R
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: QCCN; Package Shape: SQUARE;
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Datasheet
353 In Stock
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DetailsZGM130S037HGN2R Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Other Names: | 336-ZGM130S037HGN2RCT 336-ZGM130S037HGN2RTR 336-ZGM130S037HGN2RDKR |
| Nominal Supply Voltage: | 1.8 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.3 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 64 |
| Package Equivalence Code: | LCC64,.35SQ,20 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Length: | 9 mm |
| JESD-30 Code: | S-PQCC-N64 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | QCCN |
| Width: | 9 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |
