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TLK2711IRCP

Manufacturer

Texas Instruments
Manufacturer's Part Number

TLK2711IRCP
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HVFQFP; Package Shape: SQUARE;
Datasheet

Datasheet

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TLK2711IRCP Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.5 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1 mm
Sub-Category:	Other Telecom ICs
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	64
Terminal Position:	QUAD
Package Style (Meter):	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH
JESD-30 Code:	S-PQFP-G64
Package Shape:	SQUARE
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Package Code:	HVFQFP
Width:	10 mm
Moisture Sensitivity Level (MSL):	3
Other Names:	-TLK2711IRCP-NDR 296-12215 296-12215-NDR -296-12215-ND -TLK2711IRCPG4-NDR -296-12215 -TLK2711IRCPG4
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	TQFP64,.47SQ
Length:	10 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.5 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2.5

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