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BM70BLES1FC2-0B03AA
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberBM70BLES1FC2-0B03AA
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: XMA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsBM70BLES1FC2-0B03AA Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3 V |
Telecom IC Type: | TELECOM CIRCUIT |
Maximum Seated Height: | 2.46 mm |
Surface Mount: | YES |
Terminal Finish: | Nickel/Gold (Ni/Au) |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
No. of Terminals: | 33 |
Package Equivalence Code: | MODULE,33LEAD(UNSPEC) |
Terminal Position: | UNSPECIFIED |
Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
Data Rate: | .0086 Mbps |
Length: | 22 mm |
JESD-30 Code: | R-XXMA-N33 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Package Code: | XMA |
Width: | 12 mm |
Terminal Pitch: | 1.1 mm |
Temperature Grade: | INDUSTRIAL |