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BM70BLES1FC2-0B03AA
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberBM70BLES1FC2-0B03AA
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 33; Package Code: XMA; Package Shape: RECTANGULAR;
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Datasheet
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DetailsBM70BLES1FC2-0B03AA Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2.46 mm |
| Surface Mount: | YES |
| Terminal Finish: | Nickel/Gold (Ni/Au) |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 33 |
| Package Equivalence Code: | MODULE,33LEAD(UNSPEC) |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Data Rate: | .0086 Mbps |
| Length: | 22 mm |
| JESD-30 Code: | R-XXMA-N33 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | XMA |
| Width: | 12 mm |
| Terminal Pitch: | 1.1 mm |
| Temperature Grade: | INDUSTRIAL |
