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SA639DH/01,118

Manufacturer

NXP Semiconductors
Manufacturer's Part Number

SA639DH/01,118
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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SA639DH/01,118 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	1.1 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	24
Qualification:	Not Qualified
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Length:	7.8 mm
JESD-30 Code:	R-PDSO-G24
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	260
Package Code:	TSSOP
Width:	4.4 mm
Terminal Pitch:	.65 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	1

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