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SA639DH/01,118
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberSA639DH/01,118
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
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Datasheet
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DetailsSA639DH/01,118 Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3 V |
| Maximum Seated Height: | 1.1 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 24 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| JESD-30 Code: | R-PDSO-G24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Width: | 4.4 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Other Names: | 568-1106-6 568-1106-1 568-1106-2 935275293118 SA639DH01118 SA639DH/01-T 2156-SA639DH/01,118 SA639DH-T NXPNXPSA639DH/01,118 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 7.8 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | INDUSTRIAL |