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TLK2711AJRZQE
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ManufacturerTexas Instruments
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Manufacturer's Part NumberTLK2711AJRZQE
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DescriptionTELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 80; Package Code: VFBGA; Package Shape: SQUARE;
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Datasheet
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DetailsTLK2711AJRZQE Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.5 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 80 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | S-PBGA-B80 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | VFBGA |
Width: | 5 mm |
Moisture Sensitivity Level (MSL): | 3 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA80,9X9,20 |
Length: | 5 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 2.5 |