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WL1801MODGBMOCR

Manufacturer

Texas Instruments
Manufacturer's Part Number

WL1801MODGBMOCR
Description

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 100; Package Code: LGA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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WL1801MODGBMOCR Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.7 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2 mm
Sub-Category:	Other Telecom ICs
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD
No. of Terminals:	100
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Data Rate:	100 Mbps
JESD-30 Code:	R-PBGA-B100
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	70 Cel
Package Code:	LGA
Width:	13.3 mm
Moisture Sensitivity Level (MSL):	3
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e4
Minimum Operating Temperature:	-20 Cel
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	LGA100(UNSPEC)
Length:	13.4 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.7 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	2.9/4.8

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