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PM-8916-0-176NSP-TR-02-1-01

Manufacturer

Qualcomm
Manufacturer's Part Number

PM-8916-0-176NSP-TR-02-1-01
Description

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 176; Package Code: VFBGA; Package Shape: SQUARE; Maximum Seated Height: .86 mm;
Datasheet

Datasheet

Not In Stock

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PM-8916-0-176NSP-TR-02-1-01 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.6 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.86 mm
Surface Mount:	YES
No. of Functions:	1
No. of Terminals:	176
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length:	6.2 mm
Technology:	HVCMOS
JESD-30 Code:	S-PBGA-B176
Package Shape:	SQUARE
Terminal Form:	BALL
Package Code:	VFBGA
Width:	6.2 mm
Terminal Pitch:	.4 mm
Moisture Sensitivity Level (MSL):	3

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