BGSF110GN26E6327XTSA1 by Infineon Technologies

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BGSF110GN26E6327XTSA1

Manufacturer

Infineon Technologies
Manufacturer's Part Number

BGSF110GN26E6327XTSA1
Description

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 26; Package Code: HQCCN; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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BGSF110GN26E6327XTSA1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.77 mm
Surface Mount:	YES
Terminal Finish:	NICKEL PALLADIUM GOLD SILVER
JESD-609 Code:	e4
Minimum Operating Temperature:	-30 Cel
No. of Functions:	1
No. of Terminals:	26
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG
Length:	3.4 mm
Technology:	CMOS
JESD-30 Code:	R-PQCC-N26
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Package Code:	HQCCN
Width:	2.6 mm
Temperature Grade:	OTHER
Moisture Sensitivity Level (MSL):	1

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