BM23SPKS1NB9-0B02AA by Microchip Technology

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BM23SPKS1NB9-0B02AA

Manufacturer

Microchip Technology
Manufacturer's Part Number

BM23SPKS1NB9-0B02AA
Description

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 43; Package Code: XMA; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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BM23SPKS1NB9-0B02AA Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.7 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	1.9 mm
Surface Mount:	YES
Minimum Operating Temperature:	-20 Cel
No. of Functions:	1
No. of Terminals:	43
Package Equivalence Code:	MODULE,43LEAD(UNSPEC)
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Length:	29 mm
JESD-30 Code:	R-XXMA-N43
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	70 Cel
Package Code:	XMA
Width:	15 mm
Terminal Pitch:	1.2 mm
Temperature Grade:	COMMERCIAL

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