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HTSH5601ETK,118
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ManufacturerNXP Semiconductors
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Manufacturer's Part NumberHTSH5601ETK,118
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DescriptionTELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;
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Datasheet
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DetailsHTSH5601ETK,118 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Telecom IC Type: | TELECOM CIRCUIT |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Minimum Operating Temperature: | -25 Cel |
No. of Functions: | 1 |
No. of Terminals: | 2 |
Qualification: | Not Qualified |
Package Equivalence Code: | LCC2(UNSPEC) |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE |
JESD-30 Code: | R-PDSO-N2 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 85 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | SON |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 1 |