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NVF2955T1G
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ManufacturerOnsemi
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Manufacturer's Part NumberNVF2955T1G
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DescriptionP-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.3 W; Peak Reflow Temperature (C): 260; Avalanche Energy Rating (EAS): 225 mJ;
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Datasheet
2309 In Stock
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DetailsNVF2955T1G Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Configuration: | SINGLE WITH BUILT-IN DIODE |
| Transistor Element Material: | SILICON |
| Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
| Transistor Application: | SWITCHING |
| Maximum Drain Current (ID): | 1.7 A |
| Maximum Pulsed Drain Current (IDM): | 17 A |
| Sub-Category: | Other Transistors |
| Surface Mount: | YES |
| Terminal Finish: | Matte Tin (Sn) - annealed |
| No. of Terminals: | 4 |
| Maximum Power Dissipation (Abs): | 2.3 W |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE |
| JESD-30 Code: | R-PDSO-G4 |
| No. of Elements: | 1 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | ENHANCEMENT MODE |
| Maximum Operating Temperature: | 175 Cel |
| Case Connection: | DRAIN |
| Maximum Drain-Source On Resistance: | .185 ohm |
| Moisture Sensitivity Level (MSL): | 1 |
| Avalanche Energy Rating (EAS): | 225 mJ |
| Other Names: | NVF2955T1GOSDKR-ND 488-NVF2955T1GDKR NVF2955T1GOSCT-ND 488-NVF2955T1GTR NVF2955T1G-ND NVF2955T1GOSTR-ND NVF2955T1GOSCT 488-NVF2955T1GCT NVF2955T1GOSTR NVF2955T1GOSDKR 2156-NVF2955T1G-OS ONSONSNVF2955T1G |
| JEDEC-95 Code: | TO-261AA |
| Polarity or Channel Type: | P-CHANNEL |
| JESD-609 Code: | e3 |
| Minimum DS Breakdown Voltage: | 60 V |
| Reference Standard: | AEC-Q101 |
| Maximum Drain Current (Abs) (ID): | 2.6 A |
| Peak Reflow Temperature (C): | 260 |