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HX316LS9IBK2/8

Manufacturer

Kingston Technology Company
Manufacturer's Part Number

HX316LS9IBK2/8
Description

DDR3L DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
Datasheet

Datasheet

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HX316LS9IBK2/8 Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Organization:	512MX64
Maximum Seated Height:	30.13 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.28 V
Surface Mount:	NO
No. of Terminals:	204
No. of Words:	536870912 words
Terminal Position:	DUAL
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
JESD-30 Code:	R-XDMA-N204
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	DIMM
No. of Ports:	1
Memory Density:	34359738368 bit
Self Refresh:	NO
Sequential Burst Length:	4,8
Minimum Standby Voltage:	1.28 V
Memory IC Type:	DDR3L DRAM MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	64
No. of Functions:	2
Interleaved Burst Length:	4,8
Length:	67.6 mm
No. of Words Code:	512M
Nominal Supply Voltage / Vsup (V):	1.35
Additional Features:	ALSO OPERATES AT 1.5V ; PROGRAMMABLE CAS LATENCY
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.45 V

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