BSC900N20NS3GATMA1 by Infineon Technologies

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BSC900N20NS3GATMA1

Manufacturer

Infineon Technologies
Manufacturer's Part Number

BSC900N20NS3GATMA1
Description

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: .09 ohm; Maximum Operating Temperature: 150 Cel; Transistor Application: SWITCHING;
Datasheet

Datasheet

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BSC900N20NS3GATMA1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Configuration:	SINGLE WITH BUILT-IN DIODE
Transistor Element Material:	SILICON
Field Effect Transistor Technology:	METAL-OXIDE SEMICONDUCTOR
Transistor Application:	SWITCHING
Maximum Drain Current (ID):	15.2 A
Maximum Pulsed Drain Current (IDM):	61 A
Surface Mount:	YES
Terminal Finish:	TIN
No. of Terminals:	8
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
JESD-30 Code:	R-PDSO-N8
No. of Elements:	1
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	ENHANCEMENT MODE
Maximum Operating Temperature:	150 Cel
Case Connection:	DRAIN
Maximum Drain-Source On Resistance:	.09 ohm
Moisture Sensitivity Level (MSL):	1
Avalanche Energy Rating (EAS):	100 mJ
Polarity or Channel Type:	N-CHANNEL
JESD-609 Code:	e3
Minimum DS Breakdown Voltage:	200 V
Qualification:	Not Qualified

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