BGM15LA12E6327XTSA1 by Infineon Technologies

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BGM15LA12E6327XTSA1

Manufacturer

Infineon Technologies
Manufacturer's Part Number

BGM15LA12E6327XTSA1
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet

Datasheet

Not In Stock

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BGM15LA12E6327XTSA1 Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	2.8 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.65 mm
Surface Mount:	YES
Terminal Finish:	GOLD NICKEL
JESD-609 Code:	e4
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	12
Terminal Position:	BOTTOM
Package Style (Meter):	CHIP CARRIER
Length:	1.9 mm
JESD-30 Code:	R-XBCC-B12
Package Shape:	RECTANGULAR
Terminal Form:	BUTT
Maximum Operating Temperature:	85 Cel
Package Code:	BCC
Width:	1.1 mm
Terminal Pitch:	.4 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	1

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