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ADRF5044BCCZN-R7
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ManufacturerAnalog Devices
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Manufacturer's Part NumberADRF5044BCCZN-R7
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 24; Package Code: HLGA; Package Shape: SQUARE;
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Datasheet
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DetailsADRF5044BCCZN-R7 Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .96 mm |
Surface Mount: | YES |
Terminal Finish: | NICKEL PALLADIUM GOLD |
No. of Terminals: | 24 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
JESD-30 Code: | S-XBGA-B24 |
Package Shape: | SQUARE |
Terminal Form: | BUTT |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HLGA |
Width: | 4 mm |
Moisture Sensitivity Level (MSL): | 3 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e4 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Length: | 4 mm |
Nominal Negative Supply Voltage: | -3.3 V |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |