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CYP15G0101DXB-BBXI
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ManufacturerCypress Semiconductor
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Manufacturer's Part NumberCYP15G0101DXB-BBXI
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DescriptionINTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
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Datasheet
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DetailsCYP15G0101DXB-BBXI Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Network Interfaces |
Surface Mount: | YES |
Maximum Supply Current: | .51 mA |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 100 |
No. of Transceivers: | 1 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Data Rate: | 1500 Mbps |
Technology: | BICMOS |
JESD-30 Code: | S-PBGA-B100 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LBGA |
Width: | 11 mm |
Moisture Sensitivity Level (MSL): | 3 |
Telecom IC Type: | INTERFACE CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA100,10X10,40 |
Length: | 11 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |