CYP15G0101DXB-BBXI by Cypress Semiconductor

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CYP15G0101DXB-BBXI

  • Manufacturer
    Cypress Semiconductor
  • Manufacturer's Part Number
    CYP15G0101DXB-BBXI
  • Description
    INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LBGA; Package Shape: SQUARE;
  • Datasheet

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CYP15G0101DXB-BBXI Technical Details

TYPE DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.4 mm
Sub-Category: Network Interfaces
Surface Mount: YES
Maximum Supply Current: .51 mA
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 100
No. of Transceivers: 1
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Data Rate: 1500 Mbps
Technology: BICMOS
JESD-30 Code: S-PBGA-B100
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LBGA
Width: 11 mm
Moisture Sensitivity Level (MSL): 3
Telecom IC Type: INTERFACE CIRCUIT
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA100,10X10,40
Length: 11 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3

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