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MCP2562FDT-H/MF

Manufacturer

Microchip Technology
Manufacturer's Part Number

MCP2562FDT-H/MF
Description

CAN FD TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
Datasheet

Datasheet

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MCP2562FDT-H/MF Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	1 mm
Surface Mount:	YES
Maximum Supply Current:	70 mA
Terminal Finish:	MATTE TIN
No. of Terminals:	8
No. of Transceivers:	1
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Data Rate:	8 Mbps
Screening Level:	TS 16949
JESD-30 Code:	S-PDSO-N8
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	150 Cel
Package Code:	HVSON
Width:	3 mm
Moisture Sensitivity Level (MSL):	1
Other Names:	150-MCP2562FDT-H/MFDKR 150-MCP2562FDT-H/MFTR MCP2562FDT-H/MF-ND 150-MCP2562FDT-H/MFCT
Telecom IC Type:	CAN FD TRANSCEIVER
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
Package Equivalence Code:	SOLCC8,.12,25
Length:	3 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	AUTOMOTIVE

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