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MCP2562FDT-H/MF
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ManufacturerMicrochip Technology
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Manufacturer's Part NumberMCP2562FDT-H/MF
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DescriptionCAN FD TRANSCEIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE;
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Datasheet
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DetailsMCP2562FDT-H/MF Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 5 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1 mm |
Surface Mount: | YES |
Maximum Supply Current: | 70 mA |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 8 |
No. of Transceivers: | 1 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Data Rate: | 8 Mbps |
Screening Level: | TS 16949 |
JESD-30 Code: | S-PDSO-N8 |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 150 Cel |
Package Code: | HVSON |
Width: | 3 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | CAN FD TRANSCEIVER |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Package Equivalence Code: | SOLCC8,.12,25 |
Length: | 3 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | AUTOMOTIVE |