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MAX7033EUI+
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ManufacturerAnalog Devices
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Manufacturer's Part NumberMAX7033EUI+
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;
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Datasheet
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DetailsMAX7033EUI+ Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.1 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Maximum Supply Current: | .00688 mA |
Terminal Finish: | Matte Tin (Sn) - annealed |
No. of Terminals: | 28 |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-G28 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Maximum Operating Temperature: | 105 Cel |
Package Code: | TSSOP |
Width: | 4.4 mm |
Moisture Sensitivity Level (MSL): | 1 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | TSSOP28,.25 |
Length: | 9.7 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3/5 |