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W63AH2NBVABE

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W63AH2NBVABE
Description

LPDDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 178; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 33554432 words;
Datasheet

Datasheet

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W63AH2NBVABE Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.005 Amp
Organization:	32MX32
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1 mm
Access Mode:	MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup):	1.14 V
Surface Mount:	YES
Maximum Supply Current:	36 mA
No. of Terminals:	178
Maximum Clock Frequency (fCLK):	800 MHz
No. of Words:	33554432 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B178
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	VFBGA
Width:	11 mm
Input/Output Type:	COMMON
No. of Ports:	1
Memory Density:	1073741824 bit
Self Refresh:	YES
Sequential Burst Length:	8
Memory IC Type:	LPDDR3 DRAM
Minimum Operating Temperature:	-25 Cel
Memory Width:	32
No. of Functions:	1
Package Equivalence Code:	BGA178,13X17,32/25
Interleaved Burst Length:	8
Length:	11.5 mm
No. of Words Code:	32M
Nominal Supply Voltage / Vsup (V):	1.2
Additional Features:	SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX
Peak Reflow Temperature (C):	NOT SPECIFIED
Terminal Pitch:	.8 mm
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	1.3 V

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