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W25Q32JVSSIQ

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W25Q32JVSSIQ
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Terminal Pitch: 1.27 mm;
Datasheet

Datasheet

Not In Stock

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W25Q32JVSSIQ Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4MX8
Maximum Seated Height:	2.16 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	3 V
Surface Mount:	YES
Terminal Finish:	MATTE TIN
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	4194304 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
Technology:	CMOS
JESD-30 Code:	S-PDSO-G8
Package Shape:	SQUARE
Terminal Form:	GULL WING
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	SOP
Width:	5.28 mm
Memory Density:	33554432 bit
Memory IC Type:	FLASH
JESD-609 Code:	e3
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Alternate Memory Width:	1
Length:	5.28 mm
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	3.3
Additional Features:	2.7V NOMINAL AVAILABLE WITH 104MHZ
Peak Reflow Temperature (C):	260
Parallel or Serial:	SERIAL
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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