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THGBMNG5D1LBAIT

Manufacturer

Toshiba
Manufacturer's Part Number

THGBMNG5D1LBAIT
Description

FLASH; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY;
Datasheet

Datasheet

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THGBMNG5D1LBAIT Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4GX8
Programming Voltage (V):	2.7
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	153
No. of Words:	4294967296 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Memory Density:	34359738368 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
No. of Functions:	1
Type:	MLC NAND TYPE
No. of Words Code:	4G
Parallel or Serial:	SERIAL
Temperature Grade:	OTHER
Maximum Supply Voltage (Vsup):	3.6 V

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