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MT29F2G08ABAEAH4-IT:E
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ManufacturerMicron Technology
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Manufacturer's Part NumberMT29F2G08ABAEAH4-IT:E
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 63; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
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Datasheet
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DetailsMT29F2G08ABAEAH4-IT:E Technical Details
TYPE | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Programming Voltage (V): | 2.7 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Sub-Category: | Flash Memories |
Surface Mount: | YES |
Technology: | CMOS |
No. of Sectors/Size: | 2K |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Package Code: | VFBGA |
Toggle Bit: | NO |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA63,10X12,32 |
Ready or Busy: | YES |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Maximum Standby Current: | .0001 Amp |
Organization: | 256MX8 |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 35 mA |
Command User Interface: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 63 |
No. of Words: | 268435456 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B63 |
Maximum Operating Temperature: | 85 Cel |
Width: | 9 mm |
Memory Density: | 2147483648 bit |
Sector Size (Words): | 128K |
Memory IC Type: | FLASH |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Page Size (words): | 2K |
No. of Functions: | 1 |
Type: | SLC NAND TYPE |
Length: | 11 mm |
Maximum Access Time: | 25 ns |
No. of Words Code: | 256M |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Parallel or Serial: | PARALLEL |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Data Polling: | NO |
Power Supplies (V): | 3/3.3 |