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S25FS512SAGBHI210

Manufacturer

Spansion
Manufacturer's Part Number

S25FS512SAGBHI210
Description

FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Memory Density: 536870912 bit;
Datasheet

Datasheet

277 In Stock

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S25FS512SAGBHI210 Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	128MX4
Maximum Seated Height:	1.2 mm
Programming Voltage (V):	1.8
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
No. of Terminals:	24
Maximum Clock Frequency (fCLK):	133 MHz
No. of Words:	134217728 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B24
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	TBGA
Width:	6 mm
Boot Block:	BOTTOM
Memory Density:	536870912 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	4
No. of Functions:	1
Type:	NOR TYPE
Alternate Memory Width:	2
Length:	8 mm
No. of Words Code:	128M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	IT ALSO HAVE MEMORY WIDTH X1
Parallel or Serial:	SERIAL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	2 V

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