MT29F2G08ABAGAWP-IT:G by Micron Technology

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MT29F2G08ABAGAWP-IT:G

  • Manufacturer
    Micron Technology
  • Manufacturer's Part Number
    MT29F2G08ABAGAWP-IT:G
  • Description
    FLASH; Temperature Grade: INDUSTRIAL; No. of Functions: 1; Maximum Operating Temperature: 85 Cel; No. of Words Code: 256M; Package Body Material: PLASTIC/EPOXY;
  • Datasheet

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MT29F2G08ABAGAWP-IT:G Technical Details

TYPE DESCRIPTION
Other Names: -MT29F2G08ABAGAWP-IT:GTR
Package Body Material: PLASTIC/EPOXY
Memory Density: 2147483648 bit
Organization: 256MX8
Maximum Time At Peak Reflow Temperature (s): 30
Memory IC Type: FLASH
Terminal Finish: MATTE TIN
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: SLC NAND TYPE
No. of Words: 268435456 words
Technology: CMOS
No. of Words Code: 256M
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Temperature Grade: INDUSTRIAL

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