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MT29F2G08ABAGAWP-IT:G
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ManufacturerMicron Technology
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Manufacturer's Part NumberMT29F2G08ABAGAWP-IT:G
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DescriptionFLASH; Temperature Grade: INDUSTRIAL; No. of Functions: 1; Maximum Operating Temperature: 85 Cel; No. of Words Code: 256M; Package Body Material: PLASTIC/EPOXY;
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Datasheet
2487 In Stock
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DetailsMT29F2G08ABAGAWP-IT:G Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Other Names: | -MT29F2G08ABAGAWP-IT:GTR |
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 2147483648 bit |
| Organization: | 256MX8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Memory IC Type: | FLASH |
| Terminal Finish: | MATTE TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | SLC NAND TYPE |
| No. of Words: | 268435456 words |
| Technology: | CMOS |
| No. of Words Code: | 256M |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 260 |
| Temperature Grade: | INDUSTRIAL |