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W25Q80DVZPIG

Manufacturer

Winbond Electronics
Manufacturer's Part Number

W25Q80DVZPIG
Description

FLASH; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Write Protection: HARDWARE/SOFTWARE; Minimum Operating Temperature: -40 Cel;
Datasheet

Datasheet

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W25Q80DVZPIG Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00006 Amp
Organization:	1MX8
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	.8 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	25 mA
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	104 MHz
No. of Words:	1048576 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	R-PDSO-N8
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Endurance:	100000 Write/Erase Cycles
Package Code:	HVSON
Width:	5 mm
Serial Bus Type:	SPI
Memory Density:	8388608 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	SOLCC8,.25
Length:	6 mm
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	3
Minimum Data Retention Time:	20
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	SERIAL
Terminal Pitch:	1.27 mm
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	3/3.3

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