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XCC3135MODRNMMOBR

Manufacturer

Texas Instruments
Manufacturer's Part Number

XCC3135MODRNMMOBR
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 63; Package Code: QCCN; Package Shape: RECTANGULAR;
Datasheet

Datasheet

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XCC3135MODRNMMOBR Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	3.3 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	2.45 mm
Surface Mount:	YES
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	63
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER
Length:	20.5 mm
JESD-30 Code:	R-PQCC-N63
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Package Code:	QCCN
Width:	17.5 mm
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL

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