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SN65LVCP114ZJA
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ManufacturerTexas Instruments
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Manufacturer's Part NumberSN65LVCP114ZJA
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 167; Package Code: LFBGA; Package Shape: SQUARE;
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Datasheet
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DetailsSN65LVCP114ZJA Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.5 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.35 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 167 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Data Rate: | 14200 Mbps |
| JESD-30 Code: | S-PBGA-B167 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| No. of Channels: | 8 |
| Package Code: | LFBGA |
| Width: | 12 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: | SN65LVCP114ZJA-ND -296-39812-5-ND 296-39812-5-ND 296-39812-5 296-SN65LVCP114ZJA |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 4 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA167,14X14,32 |
| Length: | 12 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 2.5/3.3 |