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SN65LVCP114ZJA

Manufacturer

Texas Instruments
Manufacturer's Part Number

SN65LVCP114ZJA
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 167; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet

Datasheet

Not In Stock

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SN65LVCP114ZJA Technical Details

TYPE	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	2.5 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.35 mm
Sub-Category:	Other Telecom ICs
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	167
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Data Rate:	14200 Mbps
JESD-30 Code:	S-PBGA-B167
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
No. of Channels:	8
Package Code:	LFBGA
Width:	12 mm
Moisture Sensitivity Level (MSL):	3
Telecom IC Type:	TELECOM CIRCUIT
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	4
Qualification:	Not Qualified
Package Equivalence Code:	BGA167,14X14,32
Length:	12 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm
Temperature Grade:	INDUSTRIAL
Power Supplies (V):	2.5/3.3

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