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BMD-300-A-R
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ManufacturerU-blox Ag
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Manufacturer's Part NumberBMD-300-A-R
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DescriptionTELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsBMD-300-A-R Technical Details
| TYPE | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Data Rate: | 2 Mbps |
| JESD-30 Code: | R-XXMA-N |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | 250 |
| Package Code: | XMA |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 3 |