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TS3V555IN
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ManufacturerSTMicroelectronics
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Manufacturer's Part NumberTS3V555IN
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DescriptionPULSE; RECTANGULAR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsTS3V555IN Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Width (mm): | 7.62 mm |
Maximum Seated Height: | 4.8 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | NO |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 8 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | CMOS |
JESD-30 Code: | R-PDIP-T8 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Nominal Supply Voltage (Vsup): | 3 V |
Maximum Output Frequency: | 2 GHz |
JESD-609 Code: | e3 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP8,.3 |
Other IC type: | PULSE; RECTANGULAR |
Additional Features: | IT CAN ALSO OPERATE FROM A 5V NOMINAL SUPPLY |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | AUTOMOTIVE |
Maximum Supply Voltage (Vsup): | 16 V |
Power Supplies (V): | 3/16 |