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LM556MWC

Manufacturer

National Semiconductor
Manufacturer's Part Number

LM556MWC
Description

PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; Package Code: DIE; Package Shape: UNSPECIFIED; Surface Mount: YES; Qualification: Not Qualified;
Datasheet

Datasheet

619 In Stock

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LM556MWC Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Maximum Time At Peak Reflow Temperature (s):	40
Minimum Supply Voltage (Vsup):	4.5 V
Sub-Category:	Analog Waveform Generation Functions
Surface Mount:	YES
Minimum Operating Temperature:	0 Cel
No. of Functions:	2
Qualification:	Not Qualified
Package Equivalence Code:	WAFER
Terminal Position:	UPPER
Package Style (Meter):	UNCASED CHIP
Other IC type:	PULSE; RECTANGULAR
Technology:	BIPOLAR
JESD-30 Code:	X-XUUC-N
Package Shape:	UNSPECIFIED
Terminal Form:	NO LEAD
Maximum Operating Temperature:	70 Cel
Peak Reflow Temperature (C):	260
Package Code:	DIE
Nominal Supply Voltage (Vsup):	5 V
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	16 V
Power Supplies (V):	5/15
Moisture Sensitivity Level (MSL):	1

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