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LM556J
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLM556J
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DescriptionRECTANGULAR; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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Datasheet
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DetailsLM556J Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | CERAMIC, GLASS-SEALED |
Width (mm): | 7.62 mm |
Maximum Seated Height: | 5.08 mm |
Minimum Supply Voltage (Vsup): | 4.5 V |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | NO |
Terminal Finish: | TIN LEAD |
No. of Terminals: | 14 |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | BIPOLAR |
JESD-30 Code: | R-GDIP-T14 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 125 Cel |
Package Code: | DIP |
Nominal Supply Voltage (Vsup): | 5 V |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -55 Cel |
No. of Functions: | 2 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP14,.3 |
Other IC type: | RECTANGULAR |
Length: | 19.43 mm |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | MILITARY |
Maximum Supply Voltage (Vsup): | 18 V |
Power Supplies (V): | 5/15 |