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LMC555CTPX/NOPB
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ManufacturerNational Semiconductor
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Manufacturer's Part NumberLMC555CTPX/NOPB
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DescriptionPULSE; RECTANGULAR; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: FBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
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Datasheet
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DetailsLMC555CTPX/NOPB Technical Details
TYPE | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Width (mm): | 1.387 mm |
Minimum Supply Voltage (Vsup): | 1.5 V |
Sub-Category: | Analog Waveform Generation Functions |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 8 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B8 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Nominal Supply Voltage (Vsup): | 5 V |
Moisture Sensitivity Level (MSL): | 1 |
Maximum Output Frequency: | 3 GHz |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA8,3X3,20 |
Other IC type: | PULSE; RECTANGULAR |
Length: | 1.412 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 12 V |
Power Supplies (V): | 1.5/12 |