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TESEO-LIV3F

Manufacturer

STMicroelectronics
Manufacturer's Part Number

TESEO-LIV3F
Description

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; No. of Functions: 1;
Datasheet

Datasheet

Not In Stock

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TESEO-LIV3F Technical Details

TYPE	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.3 V
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	2.3 mm
Surface Mount:	NO
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	18
Terminal Position:	DUAL
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Length:	10.1 mm
JESD-30 Code:	R-XDMA-N18
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Peak Reflow Temperature (C):	NOT SPECIFIED
Width:	9.7 mm
Terminal Pitch:	1.1 mm
Temperature Grade:	INDUSTRIAL

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